PollEx PCB Thermal 
After analysis, reviewing the thermal Effect on PC board
PollEx Thermal is an easy-to-use board level finite element thermal analysis program. PollEx Thermal get its thermal components information from UPMS (Unified Part Management System) librarian or manual input properties for placed component on board. It supports various types of EDA vendor's design file and will export PCB thermal result to various types of System Level Thermal analysis software format. User can easily run with simple constraints for PCB analysis.
[Running structure of PollEx Thermal]
Features
- Tightly integrated into PollEx PCB which is interfaced with various PCB design tools.
- Performs accurate 3-D finite element steady-state thermal analysis.
- Analyzes any shape or size of PCB.
- Analyzes any type of PCB construction and material.
- Analyzes any type of cooling scheme.
- Models convection, radiation, and conduction boundary conditions.
- Models any locally varying thermal boundary condition.
- Models any component package type.
- Provides easy and convenient ways of thermal characterization of components.
- Uses component and material libraries for repetitive uses.
- Analyzes any type of component heat sink.
- Automatically generates a large scale finite element model including the PCB, components, and the interface between the components and PCB.
- Outputs temperatures at the junction and surfaces of components as well as the surfaces and mid-plane of PCB.
 [Getting a result from PollEx Thermal] |
Major Benefits
- Thermal issues are resolved very early in the design stage, eliminating costly design changes and iterations.
- Automatic modeling and fast analysis allow users to quickly validate multiple design options, optimizing the PCB and system designs.
