President and CEO
Mr.SunHue Huh is founder of Polliwog Corporation. He has over 20 years of experience in software development, marketing, and consulting in EDA industry.
"To the great beyond the good!"
Dr.MyoungGyou Jin, residing in the United States, has 31 years of experience in developing variety of advanced analysis and simulation software validating the performance, reliability, and manufacturability of electronic products for commercial use. He wrote simulation engines for electromagnetic, signal integrity, thermal, and vibration analyses and masterminded and directed the development of a collaborative design environment allowing multiple engineering discriplines to work together in real time throughout the design process. He performed electrical and mechanical analysis consulting works for numerous semiconductor and electronics companies.
Mr.SungMin Kim, residing in the United States, has 29 years of experience in EDA industry. His past experience includes developing electrical, thermal/mechanical, and manufacturing simulation software for ICs, packages, SiPs, PCBs,and systems then integrating them within various EDA tools to help customers improve their design/simulation flow.
Mr.SangSun Lee is co-founder of Polliwog Corporation and director of R&D. He has over 18 years of experience in hardware design and research and development of electrical and manufacturing validation software for electronics industry.
“The most remarkable innovation comes from only the passion!”
Mr.Daiho Ham has 29 years of experience in Electrical and Computer Engineering filed as EMI/EMC/ESD expert in SAMSUNG Electronics. He developed ECAE development guide specialized for Mobile product and also adopted 15 critical EMI/SI design rules to PollEx Suites.
Dr. Cangellaris is Professor of Electrical and Computer Engineering at the University of Illinois, Urbana-Champaign, USA. Professor Cangellaris is internationally known for his contributions in computational electromagnetics and its application to the development of efficient modeling methodologies and reduced-order, macro-modeling algorithms for electrical performance assessment of high-speed/high-frequency, packaged IC systems. Over the past twenty years, he has co-authored more than 200 papers on topics related to electromagnetic modeling and simulation for IC signal integrity. He has supervised the development of several prototype CAD tools for noise-aware signal/power distribution network analysis, several of which have been transferred successfully to industry. An IEEE Fellow, Professor Cangellaris is the co-founder of the IEEE Topical Meeting on Electrical Performance of Electronic Packaging.